View HSMS-C190_396565.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Surface Mount Chip LEDs Technical Data
HSMx-C110/C120/C150/ C170/C177/C190/C191/ C197/C265
Features
Small Size Industry Standard Footprint Compatible with IR Solder Diffused Optics Operating Temperature Range of -30C to +85C * Right Angle & Reverse Mount Package Available * Various Colors Available * Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels * * * * *
Description
These chip LEDs are designed in an industry standard package for ease of handling and use. Various different LED colors are available in nine compact, single color packages. The HSMx-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMx-C170 has the widely used 2.0 x 1.25 mm footprint with 0.8 mm profile. The HSMx-C177 has the widely used 2.0 x 1.25 mm footprint with 0.4 mm profile. The HSMx-C19x series has the industry standard 1.6 x 0.8 mm footprint with varying profile to suit designers needs, the HSMx-C190 has 0.8 mm profile, the HSMxC191 has a low profile of 0.6 mm, and the HSMx-C197 has the ultra low profile of 0.4 mm. This family with its thin profile and wide viewing angle makes this LED exceptional for backlighting applications. The HSMx-C110 is a right angle package with the universally accepted dimensions of 3.2 x 1.0 x 1.5 mm. The HSMx-C120 is a smaller right angle package with industry standard 1.6 x 0.6 x 1.0 mm. HSMx-C265 is a reverse
Applications
* * * * * Keypad Backlighting Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator
mount package with dimensions of 3.4 x 1.25 x 1.1 mm. These devices are ideal for LCD backlighting and sidelighting applications. In order to facilitate pick and place operation, these chip LEDs are shipped in tape and reel with 4000 units per reel for HSMxC120, C170, C177, C190, C191, C197 packages, and 3000 units per reel for HSMx-C110, C150, C265 packages. All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium.
2
Device Selectiion Guide
GaP Green HSMG-C110 HSMG-C120 HSMG-C150 HSMG-C170 HSMG-C177 HSMG-C190 HSMG-C191 HSMG-C197 HSMG-C265 As AlGaAs Red HSMH-C110 HSMH-C120 HSMH-C150 HSMH-C170 HSMH-C190 HSMH-C191 HSMH-C265 HER HSMS-C110 HSMS-C120 HSMS-C150 HSMS-C170 HSMS-C177 HSMS-C190 HSMS-C191 HSMS-C197 - Orange HSMD-C110 HSMD-C120 HSMD-C150 HSMD-C170 HSMD-C177 HSMD-C190 HSMD-C191 HSMD-C197 - Yellow HSMY-C110 - HSMY-C150 HSMY-C170 - HSMY-C190 HSMY-C191 HSMY-C197 - Description Untinted, Non-Diffused Untinted, Non-Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Non-Diffused
Description Untinted, Non-Diffused Untinted, Non-Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Non-Diffused
3
Package Dimensions
LED DIE CATHODE (ANODE MARK FOR HSMH-C150) MARK CATHODE (ANODE MARK FOR MARK HSMH-C170) LED DIE
1.6 (0.063) 0.8 (0.031)
1.25 (0.049)
0.62 (0.024) 3.2 (0.126 ) 2.0 (0.079 )
DIFFUSED EPOXY 0.6 (0.024)
2.0 (0.079)
POLARITY[3]
DIFFUSED EPOXY 0.3 (0.012)
1.4 (0.055)
POLARITY[3]
1.1 (0.043) PC BOARD CATHODE LINE 0.50 0.2 (0.020 0.008) 0.5 (0.020) 0.50 0.2 (0.020 0.008)
PC BOARD 0.8 (0.031) CATHODE LINE 0.4 0.15 (0.016 0.006) 0.3 (0.012) 0.4 0.15 (0.016 0.006)
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMx-C150
CATHODE (ANODE MARK FOR HSMH-C190) MARK
HSMx-C170
LED DIE CATHODE LINE (ANODE MARK FOR HSMH-C110)
LED DIE
1.0 (0.039)
0.8 (0.031) 0.4 (0.016)
2.6 (0.102 ) 3.2 (0.126 ) CLEAR EPOXY 1.5 (0.059) PC BOARD 0.5 (0.020) POLARITY
1.6 (0.063 )
1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD CATHODE LINE 0.3 0.15 (0.012 0.006)
POLARITY[3]
0.8 (0.031) 0.3 (0.012) 0.3 0.15 (0.012 0.006)
1.6 (0.063 ) 3.2 (0.126 ) 0.8 (0.031)
CATHODE LINE
1.0 (0.039)
0.7 (0.028) MIN. SOLDERING TERMINAL
SOLDERING TERMINAL
HSMx-C190
Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. 3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings.
HSMx-C110
4
CATHODE MARK
LED DIE
CATHODE MARK
LED DIE
0.8 (0.031) 0.4 (0.016)
0.62 (0.025)
1.25 (0.049)
1.6 (0.063 )
2.00 (0.079)
1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD
POLARITY
DIFFUSED EPOXY 0.40 (0.016)
POLARITY
PC BOARD
0.16 (0.006)
0.8 (0.031) 0.26 (0.010) CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN.
CATHODE LINE 0.40 0.15 (0.016 0.006) 0.40 0.15 (0.016 0.006)
1.10 (0.043) MIN.
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMx-C191
HSMx-C177
3.4 (0.134) LED DIE
CATHODE MARK (ETCHED) [ANODE MARK FOR HSMH-C265]
CATHODE MARK LED DIE
1.25 (0.049)
0.80 (0.031)
GREEN SOLDER MASK POLARITY UNDIFFUSED EPOXY 1.1 (0.043) PC BOARD 0.3 (0.012) CATHODE LINE 0.50 0.15 (0.020 0.006) 0.50 0.15 (0.020 0.006) 1.2 (0.047)
0.40 (0.016) 1.60 (0.063) POLARITY
DIFFUSED EPOXY
1.1 (0.043)
PC BOARD
0.40 (0.016)
0.16 (0.006) CATHODE LINE 0.30 0.15 (0.012 0.006) 0.70 (0.028) MIN.
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMx-C265
Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. 3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings.
HSMx-C197
5
LED DIE
CATHODE MARK (ANODE MARK FOR HSMH-C120)
0.3 (0.012) 0.6 (0.024)
1.6 (0.063)
POLARITY CLEAR EPOXY 1.2 (0.047)
1.0 (0.039) PC BOARD 0.4 (0.016)
3 - 0.3 (0.012) CATHODE LINE
SOLDERING TERMINAL
HSMx-C120
Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. 3. Polarity for HSMH-C1x0 will be the opposite of what is shown on above drawings.
6
Absolute Maximum Ratings for GaP at TA=25C
Parameter DC Forward Current [1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (I R=100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature C110/150/265 25 100 65 5 95 -30 to +85 -40 to +85 C120/170/177/190/191/197 Units 20 mA 100 mA 52 mW 5 V 95 C -30 to +85 C -40 to +85 C See reflow soldering profile (Figure 9 & 10)
Absolute Maximum Ratings for AlGaAs at TA=25C
Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR =100A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature C110/150 30 100 78 5 95 -30 to +85 -40 to +85 C120/170/177/190/191/197/265 25 100 65 5 95 -30 to +85 -40 to +85 See reflow soldering profile (Figure 9 & 10) Units mA mA mW V C C C
Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25C. 2. Pulse condition of 1/10 duty and 0.1 msec. width.
Electrical Characteristics at TA=25C
Reverse Capacitance Forward Voltage Breakdown C(pF), Thermal Part Number Color VF(Volts) VR(Volts) @ VF = 0 V, Resistance @ IF = 20 mA @ IR = 100 A f = 1 MHz RJ-P (C/W) Typ. Max. Min. Typ. Typ. HSMS-C110/150 HER 2.1 2.6 5 5 400 HSMS-C120 350 HSMS-C170/177/190/191/197 250 HSMD-C110/150 Orange 2.2 2.6 5 7 400 HSMD-C120 350 HSMD-C170/177/190/191/197 250 HSMY-C110/150 Yellow 2.1 2.6 5 6 400 HSMY-C170/190/191/197 250 HSMG-C110/150 Green 2.2 2.6 5 9 400 HSMG-C120 350 HSMG-C170/177/190191/197/265 250 HSMH-C110/150 AlGaAs 1.8 2.6 5 18 460 HSMH-C120 400 HSMH-C170/190/191/265 300
7
Optical Characteristics at TA=25C
Part Number HSMG-C110/177/197 HSMG-C120 HSMG-C150/170/190/191/265 HSMS-C110/177/197 HSMS-C120 HSMS-C150/170/190/191 HSMD-C110/177/197 HSMD-C120 HSMD-C150/170/190/191 HSMY-C110/197 HSMY-C150/170/190/191 HSMH-C110 HSMH-C120 HSMH-C150/170/190/191/265 Luminous Peak Dominant Intensity[1] Wavelength Wavelength Viewing Color Iv(mcd)@20mA Angle 2 1/2()[2] peak(nm) d(nm) Min. Typ. Typ. Typ. Typ. Green 4.5 15.0 570 572 130 155 170 HER 2.8 10.0 630 626 130 155 170 Orange 2.8 8.0 605 604 130 155 170 Yellow 2.8 8.0 589 586 130 170 AlGaAs 7.2 17.0 660 639 130 155 170
Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Color Bin Limits [1] Green Color Bins[1]
Bin ID A B C D E
Tolerance: 0.5 nm
Yellow/Amber Color Bins[1]
Bin ID A B C D E F Dom. Wavelength (nm) Min. Max. 582.0 584.5 584.5 587.0 587.0 589.5 589.5 592.0 592.0 594.5 594.5 597.0
Dom. Wavelength (nm) Min. Max. 561.5 564.5 564.5 567.5 567.5 570.5 570.5 573.5 573.5 576.5
Tolerance: 0.5 nm
Orange Color
Bin ID A B C D E F
Tolerance: 1 nm
Bins[1]
Dom. Wavelength (nm) Min. Max. 597.0 600.0 600.0 603.0 603.0 606.0 606.0 609.0 609.0 612.0 612.0 615.0
8
Light Intensity (Iv) Bin Limits[1]
Bin ID A B C D E F G H J K L M Intensity Min. 0.11 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 (mcd) Max. 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 Bin ID N P Q R S T U V W X Y Intensity Min. 28.50 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 (mcd) Max. 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00
Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins.
Tolerance: 15%
1.0 GREEN
RELATIVE INTENSITY
AlGaAs
YELLOW
0.5 ORANGE HER
0
500
550
600
650
700
750
WAVELENGTH - nm
Figure 1. Relative Intensity vs. Wavelength.
100
IF - FORWARD CURRENT - mA
LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
1.6 AlGaAs
HER AlGaAs GREEN
IF MAX. - MAXIMUM FORWARD CURRENT - mA
35 30 25 20 15 10 5 0 0
C110/C150 AlGaAs
C110/C150/C265 HER, ORANGE, YELLOW, GREEN C120/C170/C177/ C190/C191/C197/ C265 AlGaAs
1.2
10
0.8
1 YELLOW 0.1 ORANGE 1.5 1.7 1.9 2.1 2.3
0.4 GaP 0 0 10 20 30 40
C120/C170/ C177/C190/ C191/C197 HER, ORANGE, YELLOW, GREEN
RJ-A = 600C/W
RJ-A = 800C/W 40 60 80 100
20
VF - FORWARD VOLTAGE - V
IF - FORWARD CURRENT - mA
TA - AMBIENT TEMPERATURE - C
Figure 2. Forward Current vs. Forward Voltage.
Figure 3. Luminous Intensity vs. Forward Current.
Figure 4. Maximum Forward Current vs. Ambient Temperature.
9
1.00 0.90
RELATIVE INTENSITY - %
0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
1.00 0.90
RELATIVE INTENSITY - %
0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative Intensity vs. Angle for HSMx-C110.
100 90
RELATIVE INTENSITY
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE 100 90
RELATIVE INTENSITY
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative Intensity vs. Angle for HSMx-C120.
10
100 90
RELATIVE INTENSITY - %
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 7. Relative Intensity vs. Angle for HSMx-C177 and C197.
1.00 0.90
RELATIVE INTENSITY - %
0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 8. Relative Intensity vs. Angle for HSMx-C150, C170, C190, C191 and C265.
10 to 20 SEC. 217 C TEMPERATURE 255 C (+5/-0) 3 C/SEC. MAX. 100 - 150 C 6 C/SEC. MAX.
10 SEC. MAX.
TEMPERATURE
230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. 3C/SEC. MAX.
MAX. 120 SEC.
60 to 150 SEC.
TIME * THE TIME FROM 25 C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 9. Recommended Reflow Soldering Profile.
Figure 10. Recommended Pb-Free Reflow Soldering Profile.
0.8 (0.031)
1.5 (0.059)
1.2 (0.047)
1.2 (0.047)
1.5 (0.059) 2.0 (0.079) 1.5 (0.059)
1.2 (0.047)
0.9 (0.035)
0.8 (0.031) 0.7 (0.028)
0.8 (0.031)
Figure 11. Recommended Soldering Pattern for HSMx-C150.
Figure 12. Recommended Soldering Pattern for HSMx-C170 and C177.
Figure 13. Recommended Soldering Pattern for HSMx-C190, C191 and C197.
11
5.0 (0.200) 0.9 (0.035) 0.9 (0.035)
0.4 (0.016) 0.4 (0.016)
1.0 (0.039) 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.059)
0.8 (0.031) 1.2 (0.047) 0.8 (0.031) 0.15 (0.006)
0.7 (0.028)
CENTERING BOARD
Figure 14. Recommended Soldering Pattern for HSMx-C110.
Figure 15. Recommended Soldering Pattern for HSMx-C120.
USER FEED DIRECTION
2.2 (0.087) DIA. PCB HOLE
CATHODE SIDE
1.25 (0.049)
1.4 (0.055)
2.3 (0.091)
1.4 (0.055)
PRINTED LABEL
Figure 16. Recommended Soldering Pattern for HSMx-C265.
Figure 17. Reeling Orientation.
8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 13.1 0.5 (O 0.516 0.020)
O 20.20 MIN. (O 0.795 MIN.) 3.0 0.5 (0.118 0.020)
178.40 1.00 (7.024 0.039)
59.60 1.00 (2.346 0.039)
4.0 0.5 (0.157 0.020)
6 PS
5.0 0.5 (0.197 0.020)
Figure 18. Reel Dimensions. Note: All dimensions in millimeters (inches).
12
4.00 (0.157) 1.50 (0.059)
CATHODE
DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002)
1.75 (0.069)
3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012)
DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157)
CARRIER TAPE USER FEED DIRECTION COVER TAPE
TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C110 SERIES HSMx-C120 SERIES HSMx-C150 SERIES HSMx-C170 SERIES HSMx-C177 SERIES HSMx-C190 SERIES HSMx-C191 SERIES HSMx-C197 SERIES DIM. A 0.10 (0.004) 3.40 (0.134) 1.90 (0.075) 3.50 (0.138) 2.30 (0.091) 2.30 (0.091) 1.80 (0.071) 1.86 (0.073) 1.75 (0.069) DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 1.70 (0.067) 1.20 (0.047) 1.15 (0.045) 0.80 (0.031) 1.88 (0.074) 1.27 (0.050) 1.45 (0.057) 0.95 (0.037) 1.40 (0.055) 0.60 (0.024) 0.95 (0.037) 0.87 (0.034) 0.89 (0.035) 0.87 (0.034) 0.95 (0.037) 0.60 (0.024)
HSMx-C110/C120 POSITION IN CARRIER TAPE
DIM. A (SEE TABLE 1)
DIM. B (SEE TABLE 1)
R 1.0 0.05 (0.039 0.002) R 0.5 0.05 (0.020 0.002)
4.00 (0.157) 1.50 (0.059)
CATHODE
DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002)
1.75 (0.069)
3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012)
DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157)
CARRIER TAPE USER FEED DIRECTION COVER TAPE
TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 1.30 (0.051)
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057)
Figure 19. Tape Dimensions.
END
START
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MOUNTED WITH COMPONENTS
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE.
Storage Condition: 5 to 30 C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/- 5C for 20 hours.
Convective IR Reflow Soldering
For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components.
Figure 20. Tape Leader and Trailer Dimensions.
Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.)unless otherwise specified.
www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2004 Agilent Technologies, Inc. Obsoletes 5988-6271EN May 17, 2004 5989-0463EN

▲Up To Search▲

Price & Availability of HSMS-C190

	To Download HSMS-C190 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .